40: Plasma-jet printing for direct writing of self-sintered metal traces with enhanced adhesion

Sunday, June 28, 2026 7:00 PM to 9:00 PM · 2 hr. (America/Boise)
400A/B/D (Boise Centre East)
Poster Presentation

Information

Abstract: Plasma-jet printers incorporate a dielectric barrier discharge plasma within the printhead, which allows simultaneous surface activation, nanoparticle deposition, and in situ self-sintering of printed features. In this study, PJP is used to improve the surface hydrophilicity, enhance adhesion, and fabricate self-sintered conductive patterns. The work also demonstrates the capability of PJP for simultaneous deposition of multiple materials, expanding its capability across a broader range of systems. A systematic investigation is carried out to evaluate the influence of parameters such as voltage, gas flow rate, and working distance on surface energy and wettability. By optimizing these parameters, improved nanoparticle adhesion on treated surfaces is achieved. In addition, the effect of plasma processing parameters on electrical performance was examined. The results show a 6X improvement in the adhesion strength and achieved a resistivity of 1.5E-6 Ω.m. through low-temperature plasma sintering.
Author/Institution List
L. Prakasan, H. Subbaraman, Electrical Engineering and Computer Science, Oregon State University, Corvallis, Oregon, UNITED STATES|

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